Acoustic Invisibility Cloak Makes Objects Unhearable - FoxNews.com

From: Its from Onion <areda..._at_msn.com>
Date: Thu, 30 Jun 2011 12:26:46 -0500

>From - Sat Mar 02 00:57:28 2024
Received: by 10.236.81.147 with SMTP id m19mr1390460yhe.1.1348028975112;
        Tue, 18 Sep 2012 21:29:35 -0700 (PDT)
X-BeenThere: tscm-l2006_at_googlegroups.com
Received: by 10.236.149.34 with SMTP id w22ls1117507yhj.8.gmail; Tue, 18 Sep
 2012 21:29:31 -0700 (PDT)
Received: by 10.236.116.74 with SMTP id f50mr1445582yhh.33.1348028971507;
        Tue, 18 Sep 2012 21:29:31 -0700 (PDT)
Received: by 10.236.116.74 with SMTP id f50mr1445581yhh.33.1348028971491;
        Tue, 18 Sep 2012 21:29:31 -0700 (PDT)
Return-Path: <areda..._at_msn.com>
Received: from snt0-omc3-s27.snt0.hotmail.com (snt0-omc3-s27.snt0.hotmail.com. [65.55.90.166])
        by gmr-mx.google.com with ESMTP id r20si165412ano.1.2012.09.18.21.29.31;
        Tue, 18 Sep 2012 21:29:31 -0700 (PDT)
Received-SPF: pass (google.com: domain of areda..._at_msn.com designates 65.55.90.166 as permitted sender) client-ip=65.55.90.166;
Authentication-Results: gmr-mx.google.com; spf=pass (google.com: domain of areda..._at_msn.com designates 65.55.90.166 as permitted sender) smtp.mail=areda..._at_msn.com
Received: from SNT107-W52 ([65.55.90.135]) by snt0-omc3-s27.snt0.hotmail.com with Microsoft SMTPSVC(6.0.3790.4675);
         Tue, 18 Sep 2012 21:29:30 -0700
Message-ID: <SNT107-W52497E16D7971001EB5EF8BC9B0_at_phx.gbl>
Return-Path: areda..._at_msn.com
Content-Type: multipart/alternative;
        boundary="_703e0329-0d3e-4d21-b331-2b84704c9572_"
X-Originating-IP: [76.218.225.8]
From: Its from Onion <areda..._at_msn.com>
Subject: Worlds smallest RFID chip (dust)
Date: Wed, 19 Sep 2012 04:29:30 +0000
Importance: Normal
MIME-Version: 1.0
Bcc:
X-OriginalArrivalTime: 19 Sep 2012 04:29:30.0903 (UTC) FILETIME=[5CD1FA70:01CD961F]

--_703e0329-0d3e-4d21-b331-2b84704c9572_
Content-Type: text/plain; charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable



The Japanese giant Hitachi has developed the world's smallest and thinnest =
Radio Frequency Identification (RFID) chip. Measuring only 0.15 x 0.15 mill=
imeters in size and 7.5 micrometers thick, the wireless chip is a smaller v=
ersion of the previous record holder - Hitachi's 0.4 x 0.4 mm "Micro-Chip".=
 The company used semiconductor miniaturization and electron beam technolog=
y to write data on the chip substrates to achieve this decrease in size. Th=
e new chips have a wide range of potential applications from military to tr=
ansportation, logistics and even consumer electronics.

http://thefutureofthings.com/news/1032/hitachi-develops-worlds-smallest-rfi=
d-chip.html

 Hitachi's RFID Chips (Credit: Hitachi Global)Nicknamed "Powder" or "Dust",=
 these chips consist of 128-bit ROM (Read Only Memory) that can store a 38-=
digit number. Hitachi says the distance between each circuit element was re=
duced using the Silicon-on-Insulator (SOI) process, where an insulation lay=
er and a monocrystalline silicon layer are formed upon the silicon base sub=
strate, and the transistor is then formed on this SOI substrate. When compa=
red to the conventional process where a transistor is formed directly upon =
the silicon substrate, this technology significantly reduces parasitic capa=
citance and current leakage, improving the transistor's performance. The SO=
I process also prevents the interference between neighboring devices, which=
 often causes product malfunctions. Thanks to an insulator surrounding each=
 device, Hitachi experts say that even when the devices are in close proxim=
ity, higher integration is achieved on an even smaller area. =09=09 =09 =
=09=09 =20
--_703e0329-0d3e-4d21-b331-2b84704c9572_
Content-Type: text/html; charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable

<html>
<head>
<style><!--
.hmmessage P
{
margin:0px;
padding:0px
}
body.hmmessage
{
font-size: 10pt;
font-family:Tahoma
}
--></style></head>
<body class=3D'hmmessage'><div dir=3D'ltr'>
<font face=3D"Times New Roman" size=3D"3" style=3D"font-size:12pt"><br id=
=3D"ecxFontBreak"></font><div><font face=3D"Times New Roman" size=3D"3" sty=
le=3D"font-size:12pt"><br></font></div><div><span style=3D"font-family: ari=
al; font-weight: bold; line-height: 18px; background-color: rgb(255, 255, 2=
55); ">The Japanese giant Hitachi has developed the world's smallest and th=
innest Radio Frequency Identification (RFID) chip. Measuring only 0.15 x 0.=
15 millimeters in size and 7.5 micrometers thick, the wireless chip is a sm=
aller version of the previous record holder - Hitachi's 0.4 x 0.4 mm "Micro=
-Chip". The company used semiconductor miniaturization and electron beam te=
chnology to write data on the chip substrates to achieve this decrease in s=
ize. The new chips have a wide range of potential applications from militar=
y to transportation, logistics and even consumer electronics.</span>
</div><div><span style=3D"font-family: arial; font-weight: bold; line-heigh=
t: 18px; background-color: rgb(255, 255, 255); "><br></span></div><div><a h=
ref=3D"http://thefutureofthings.com/news/1032/hitachi-develops-worlds-small=
est-rfid-chip.html">http://thefutureofthings.com/news/1032/hitachi-develops=
-worlds-smallest-rfid-chip.html</a>
</div><div><br></div><div><table width=3D"570" border=3D"0" cellpadding=3D"=
0" cellspacing=3D"0" align=3D"center" style=3D"color: rgb(0, 0, 0); font-fa=
mily: arial; font-size: 12px; text-align: start; background-color: rgb(255,=
 255, 255); margin-top: 15px; "><tbody><tr><td class=3D"txt_13px_bold" styl=
e=3D"font-weight: bold; font-size: 13px; line-height: 18px; "><table width=
=3D"100%" border=3D"0"><tbody><tr><td nowrap=3D"" valign=3D"top" align=3D"r=
ight"><img src=3D"http://thefutureofthings.com/design/size_reg.png" border=
=3D"0" style=3D"border-width: 0px; margin-left: 10px; vertical-align: botto=
m; cursor: pointer; float: right; "><div class=3D"addthis_toolbox addthis_d=
efault_style " style=3D"float: right; "><a class=3D"addthis_button_facebook=
_like" fb:like:layout=3D"button_count" style=3D"width: 90px; "></a><a class=
=3D"addthis_button_tweet" style=3D"width: 90px; "></a><a class=3D"addthis_b=
utton_google_plusone" g:plusone:size=3D"medium"></a><a class=3D"addthis_but=
ton_stumbleupon_badge" style=3D"width: 75px; padding-right: 20px; "></a><a =
class=3D"addthis_counter addthis_pill_style"></a></div></td></tr></tbody></=
table></td></tr><tr><td class=3D"txt_12px_regular" id=3D"body_text" style=
=3D"line-height: 16px; "><div style=3D"float: right; padding-top: 10px; mar=
gin: 0px; "></div><BR><table cellspacing=3D"0" cellpadding=3D"0" border=3D"=
0" align=3D"right"><tbody><tr><td><table cellspacing=3D"0" cellpadding=3D"1=
0" class=3D"imageBox" style=3D"background-color: rgb(244, 244, 244); margin=
: 10px 0px 10px 10px; background-position: initial initial; background-repe=
at: initial initial; "><tbody><tr><td style=3D"padding-bottom: 3px; ">&nbsp=
;<a href=3D"http://thefutureofthings.com/upload/image/news/hitachi-makes-wo=
rlds-smallest-rfid-chips/hitachi-smallest-rfid2.jpg" target=3D"_blank" styl=
e=3D"color: rgb(19, 86, 115); "><img width=3D"200" height=3D"143" src=3D"ht=
tp://thefutureofthings.com/upload/image/news/hitachi-makes-worlds-smallest-=
rfid-chips/hitachi-smallest-rfid2_thumb.jpg" alt=3D"Hitachi's RFID Chips (C=
redit: Hitachi Global)" style=3D"border-width: 0px; "></a></td></tr><tr><td=
 class=3D"imageBox" style=3D"padding-top: 3px; padding-bottom: 7px; font-si=
ze: 11px; "><center>Hitachi's RFID Chips (Credit: Hitachi Global)</center><=
/td></tr></tbody></table></td></tr></tbody></table><BR>Nicknamed "Powder" o=
r "Dust", these chips consist of 128-bit ROM (Read Only Memory) that can st=
ore a 38-digit number. Hitachi says the distance between each circuit eleme=
nt was reduced using the&nbsp;<a target=3D"_blank" href=3D"http://en.wikipe=
dia.org/wiki/Silicon_on_insulator" style=3D"color: rgb(19, 86, 115); ">Sili=
con-on-Insulator (SOI)</a>&nbsp;process, where an insulation layer and a mo=
nocrystalline silicon layer are formed upon the silicon base substrate, and=
 the transistor is then formed on this SOI substrate. When compared to the =
conventional process where a transistor is formed directly upon the silicon=
 substrate, this technology significantly reduces parasitic capacitance and=
 current leakage, improving the transistor's performance. The SOI process a=
lso prevents the interference between neighboring devices, which often caus=
es product malfunctions. Thanks to an insulator surrounding each device,&nb=
sp;<a target=3D"_blank" href=3D"http://www.hitachi.com/" style=3D"color: rg=
b(19, 86, 115); ">Hitachi</a>&nbsp;experts say that even when the devices a=
re in close proximity, higher integration is achieved on an even smaller ar=
ea.<BR></td></tr></tbody></table></div> =09=09 =09 =09=09 </div></body>
</html>
--_703e0329-0d3e-4d21-b331-2b84704c9572_--
Received on Sat Mar 02 2024 - 00:57:28 CST

This archive was generated by hypermail 2.3.0 : Sat Mar 02 2024 - 01:11:47 CST